Vertiv
11 项更新 · 2026年6月
2 content pieces·2 technical updates·1 case studies·1 feature updates
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The Open Compute Project (OCP) and major silicon vendors (NVIDIA, AMD, Intel) collaborated on a white paper proposing a 30°C minimum coolant temperature standard for AI/ML hardware cooling. This stand…
Vertiv’s research debunks the myth that higher chip temperatures universally enable compressor-less cooling, emphasizing geography, ambient conditions, and water availability as critical factors. The …
Vertiv published a guide on designing liquid cooling infrastructure for scalability, emphasizing oversized headers, modular components, and phased expansion to avoid costly retrofits. The article high…
Compass Datacenters and Vertiv deployed Vertiv SmartRun, an overhead prefabricated infrastructure system, to streamline data hall deployment for AI workloads. The standardized, factory-assembled syste…
Vertiv and NVIDIA are collaborating to enable gigawatt-scale AI factories, where power, cooling, and compute are co-designed as a single system. Digital twin technology and prefabricated modules aim t…
Vertiv introduced EnergyCore Lithium battery cabinets featuring integrated battery management, real-time SOC/SOH monitoring, and compatibility with AI-driven power demands. The solution reduces footpr…
